All reflective wafer defect inspection and review systems and methods
AssigneeKLA-Tencor Corporation
InventorsShiyu Zhang, Wei Zhao
Life of this patent
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AssigneeKLA-Tencor Corporation
InventorsShiyu Zhang, Wei Zhao
Estimating the term…
Disclosed are methods and apparatus for reflecting, towards a sensor, an Infrared to vacuum ultra-violet (VUV) light that is reflected from a target substrate. The system includes a first mirror arranged to receive and reflect the Infrared to VUV light that is reflected from the target substrate and a second mirror arranged to receive and reflect Infrared to VUV light that is reflected by the first mirror. The first and second mirrors are arranged and shaped so as to reflect Infrared to VUV light from the target substrate towards an optical axis of the apparatus. In another embodiment, the apparatus can also include a third mirror arranged to receive and reflect the Infrared to VUV light that is reflected by the second mirror and a fourth mirror arranged to receive and reflect such illuminating light that is reflected by the third mirror towards the sensor. In one more embodiment, a reflecting or refracting optics is used to relay the image by above optics to the sensor; various magnification is achieved by adjusting the distance between the intermediate image and the relay optics.
An apparatus for reflecting, towards a sensor, an illuminating light that is reflected from a target substrate, the apparatus comprising:
An objective optics system for reflecting Infrared to vacuum ultra-violet (VUV) spectral band light that is reflected from a target substrate in response to Infrared to VUV light that illuminates the target substrate, the system comprises:
An apparatus for reflecting, towards a sensor, Infrared to vacuum ultra-violet (VUV) light that is reflected from a target substrate, the apparatus comprising:
Dependencies are inferred from the claim text.