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US 10,309,230 B2Granted
Co-formed element with low conductivity layer
AssigneeUnited Technologies Corporation
InventorMichael G McCaffrey
Life of this patent
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Abstract
A co-formed element includes a core structure which has a root portion and is formed from a high thermal conductivity ceramic matrix composite material, and a low thermal conductivity layer co-formed with the core structure and surrounding the root portion of the core structure.
Claims5
A process for forming a co-formed element comprising the steps of:
- placing a core structure formed from a fully densified, high thermal conductivity ceramic matrix material having a residual porosity less than 10% into a mold;
- placing a three dimensional woven material into said mold so that said three dimensional woven material surrounds a root portion of said core structure;
- injecting a matrix material into said mold so that said three dimensional woven material is infiltrated with said matrix material;
- and
- allowing said matrix material to solidify to form said co-formed element.
2 more elements
Dependencies are inferred from the claim text.