Substrate treating apparatus and substrate treating method

A substrate treating apparatus comprising:

• a process chamber;
• a substrate support unit configured to support a substrate in the process chamber;
• a gas supply unit configured to supply a process gas into the process chamber;
• and
• an exhaust adjusting unit configured to adjust a discharge amount of the process gas and residual gases in the process chamber,
• wherein the exhaust adjusting unit comprises:
• a ring-shaped first exhaust ring provided on a side of the substrate support unit and having a plurality of exhaust holes;
• a ring-shaped second exhaust ring provided below the ring-shaped first exhaust ring and having a plurality of exhaust holes;
• and
• an adjustment part configured to adjust relative locations of the plurality of exhaust holes provided in the ring-shaped second exhaust ring with respect to the plurality of exhaust holes provided in the ring-shaped first exhaust ring,
• wherein the plurality of exhaust holes of the ring-shaped first exhaust ring have shapes corresponding to the plurality of exhaust holes of the ring-shaped second exhaust ring,
• wherein the adjustment part comprises a rotary member connected to the ring-shaped second exhaust ring to rotate the ring-shaped second exhaust ring, and
• wherein the rotary member comprises:
• a support member connected to lower surfaces of opposite ends of the ring-shaped second exhaust ring;
• a support plate connected to the support member and having a ring shape corresponding to the ring-shaped second exhaust ring;
• and
• a driving unit configured to rotate the support plate.