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US 10,308,845 B2Granted
Adhesive tape featuring adhesive with continuous polymer phase
AssigneeTesa SE
InventorsChristian Schuh, Klaus Keite-Telgenbüscher, Chris Gäbert, Minyoung Bai
Life of this patent
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Abstract
An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.
Claims19
Adhesive tape containing an adhesive comprising
- at least one polymer selected from the group consisting of acrylonitrile-butadiene rubbers, poly(ethylene oxide), poly(ethylene terephthalate), poly(carbonates), poly(phenylene oxides), poly(urethanes), poly(ureas), poly(amides) (PA), poly(lactate) (PLA), poly(etheretherketone) (PEEK), poly(sulphone) (PSU) and poly(ethersulphone) (PES)
- optionally a tackifier resin
- at least one epoxy resin, the adhesive comprising at least 104 parts of the at least one epoxy resin per 100 parts of polymer and tackifier resin
- at least one initiator and/or curing agent and/or accelerator wherein said at least one polymer is per se not pressure-sensitively adhesive, but the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive, and the at least one epoxy resin
- is a solid having a softening temperature of at least 45° C., or
- has a viscosity at 25° C. of at least 20 Pa s.
3 more elements
Dependencies are inferred from the claim text.