Pressure-sensitive adhesive, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
AssigneeNitto Denko Corporation
InventorsMasatsugu Higashi, Akiko Tanaka, Aimi Matsuura, Kiyoe Shigetomi, Tetsuo Inoue
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Abstract
A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 99.5% by weight of an alkyl (meth)acrylate having a branched alkyl group of 10 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.
Claims12
A pressure-sensitive adhesive sheet, comprising a transparent conductive film as a support and a pressure-sensitive adhesive layer formed on at least one surface of the transparent conductive film,
- wherein the transparent conductive film comprises a metal thin layer and a transparent plastic film substrate, wherein the pressure-sensitive adhesive layer is formed on a surface of the metal thin layer,
- wherein the pressure-sensitive adhesive layer is obtained from a pressure-sensitive adhesive composition,
- wherein the pressure-sensitive adhesive composition comprises a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 45% by weight of an alkyl (meth)acrylate having a branched alkyl group of 14 to 24 carbon atoms at an ester end, and
- wherein the branched alkyl group of 14 to 24 carbon atoms has a t-butyl group.
Dependencies are inferred from the claim text.