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US 10,308,841 B2Granted
Process and apparatus for detaching a display module bonded by a liquid optically clear adhesive
AssigneeHenkel AG & Co. KGaA
InventorsEugen Bilcai, Steven Dufresne
Life of this patent
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Abstract
The present invention relates to a process for detaching a component from an electronic assembly. In particular, the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).
Claims10
A process for detaching a component from an electronic assembly, comprising the steps of:
- (a) providing an apparatus for generating electromagnetic radiation;
- providing the electronic assembly comprising an outer component bonded to an inner component by an optically clear adhesive;
- (b) transmitting electromagnetic radiation at a first intensity for a first time from the apparatus through the outer component to the adhesive;
- (c) heating the adhesive by transmission of the first intensity of the electromagnetic radiation to increase the temperature of the adhesive to about 50° C. to about 100° C.;
- (d) after the adhesive has been heated to the temperature of about 50° C. to about 100° C., transmitting electromagnetic radiation at a second intensity for a second time from the apparatus to the adhesive to maintain the adhesive at a temperature of about 50° C. to about 100° C., wherein the second intensity is lower than the first intensity;
- (e) cooling the adhesive;
- and thereafter
- (f) detaching the components from the electronic assembly.
5 more elements
A process for detaching a component from an electronic assembly, comprising the steps of:
- (a) providing an apparatus for generating electromagnetic radiation;
- providing the electronic assembly comprising an outer component bonded to an inner component by an optically clear adhesive;
- (b) transmitting electromagnetic radiation at a first intensity for a first time from the apparatus through the outer component to the adhesive;
- (c) heating the adhesive by transmission of the first intensity of the electromagnetic radiation to increase the temperature of the adhesive to about 50° C. to about 100° C.;
- (d) after the adhesive has been heated to the temperature of about 50° C. to about 100° C., transmitting electromagnetic radiation at a second intensity for a second time from the apparatus to the adhesive to maintain the adhesive at a temperature of about 50° C. to about 100° C., wherein the second intensity is lower than the first intensity;
- (e) transmitting electromagnetic radiation at a third intensity for a third time from the apparatus to the adhesive followed by transmitting electromagnetic radiation at a fourth intensity for a fourth time from the apparatus to the adhesive;
- wherein the third intensity is higher than the fourth intensity and both the third intensity and the fourth intensity are lower than the first intensity;
- and
- (f) detaching the components from the electronic assembly.
6 more elements
Dependencies are inferred from the claim text.