Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition
AssigneeShengyi Technology Co., Ltd.
InventorsSuwen Ye, Guofang Tang
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AssigneeShengyi Technology Co., Ltd.
InventorsSuwen Ye, Guofang Tang
Estimating the term…
The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
An aluminum-based copper-clad laminate comprising a copper foil layer and an aluminum-based layer with an insulation layer being coated between the copper foil layer and the aluminum-based layer, wherein the insulation layer is prepared from an organosilicone resin composition, wherein the organosilicone resin composition comprises in parts by weight:
Dependencies are inferred from the claim text.