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US 10,308,790 B2Granted
Resin composition and resin molding
AssigneeFuji Xerox Co., Ltd.
InventorKenji Yao
Life of this patent
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Abstract
A resin composition includes: a cellulose acetate having a weight-average molecular weight of 30,000 to 90,000 and a substitution degree of 2.1 to 2.6; and a polyhydroxyalkanoate.
Claims20
A resin composition, comprising:
- a cellulose acetate having a weight-average molecular weight of 30,000 to 90,000 and a substitution degree of 2.1 to 2.6;
- and
- a polyhydroxyalkanoate.
A resin composition, comprising:
- a cellulose acetate having a weight-average molecular weight of 30,000 to 90,000 and a substitution degree of 2.1 to 2.6;
- a polyhydroxyalkanoates;
- and
- at least one copolymer having olefin structural units and alkyl (meth)acrylate structural units, the copolymer being selected from the group consisting of olefin-alkyl (meth)acrylate copolymers and olefin-(meth)acrylate-(unsaturated 1,2-dicarboxylic anhydride) copolymers.
1 more element
Dependencies are inferred from the claim text.