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US 10,308,503 B2Granted
Dual cavity pressure structures
AssigneeInvenSense, Inc.
InventorsJong Il Shin, Peter Smeys, Daesung Lee
Life of this patent
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Abstract
An apparatus includes a cavity within a substrate. A MEMS structure is within the cavity, wherein the cavity includes the MEMS structure. A trench is connected to the cavity, wherein the trench is not directly opposite the MEMS structure. An oxide layer lines the trench and the cavity. A seal layer seals the trench and traps a predetermined pressure within the cavity and the trench.
Claims14
An apparatus comprising:
- a cavity within a substrate;
- a MEMS structure surrounded by the cavity;
- a trench connected to the cavity, wherein the trench is not directly opposite the MEMS structure;
- an oxide layer lining the trench and the cavity;
- and
- a seal layer, wherein the seal layer seals the trench and traps a predetermined pressure within the cavity and the trench.
3 more elements
An apparatus comprising:
- a trench in a first side of a first silicon wafer;
- a cavity connected to the trench in the first side of the first silicon wafer;
- an oxide layer on the first side and in the trench;
- a second silicon wafer bonded to the first side of the first silicon wafer;
- a MEMS (micro-electro-mechanical systems) structure in the second silicon wafer;
- a third silicon wafer bonded to the second silicon wafer,
- a layer on a second side of the first silicon wafer, wherein
- the trench is exposed in a portion of the second side of the first silicon wafer,
- the layer seals the trench, the cavity, and the MEMS structure, and
- the layer seals a pressure in the cavity.
7 more elements
Dependencies are inferred from the claim text.