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US 10,307,989 B2Granted
Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
AssigneeIsola USA Corp.
InventorRoland Schönholz
Life of this patent
Estimating the term…
Abstract
Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
Claims14
A method of preparing a laminate sheet comprising the steps of:
- (a) applying a mask to a first prepreg including a UV curable resin layer and a thermally curable resin layer wherein the mask is applied to the UV curable resin layer, the mask including at least one UV light transparent portion and at least one UV light opaque portion;
- (b) directing UV light at the mask for a period of time sufficient to cure the UV curable resin layer underlying the UV light transparent portion of the mask to form a UV light treated first prepreg having at least one cured UV resin portion and at least one uncured UV resin portion;
- (c) contacting a core layer with the UV light treated first prepreg such that the at least one cured UV resin portion and the at least one uncured UV resin portion contact the core layer to form a layup;
- and
- (d) applying heat and/or pressure to the lay-up to form a laminated layup including a semi-flexible core having a rest material portion that overlies the at least one cured UV resin portion where the semi-flexible core layer is not substantially laminated to the at least one cured UV resin portion.
2 more elements
Dependencies are inferred from the claim text.