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US 10,307,868 B2Granted
Solder alloy
AssigneeNEC Corporation
InventorYuuki Momokawa
Life of this patent
Estimating the term…
Abstract
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0 to 4.0 mass % of Ag, 0.5 to 1.0 mass % of Cu, 0.1 to 0.5 mass % of an additive element selected from the group consisting of Ca and Mn, and a balance of Sn.
Claims10
A solder alloy, comprising:
- 2.0 to 4.0 wt % of Ag, 0.5 to 1.0 wt % of Cu, 0.1 to 0.5 wt % Ca, and a balance of Sn.
Dependencies are inferred from the claim text.