Laser fiber array for singulating semiconductor wafers

An apparatus for cutting a substrate, the apparatus comprising:

• first and second lasers:
• and
• first and second optical fibers, each having an input end and an output end opposite to the input end, the input ends of the first and second optical fibers being connected to the first and second lasers respectively;
• one or more additional lasers and one or more optical fibers having input ends connected respectively to the one or more additional lasers, such that a combined output from the optical fibers forms a horizontal array of laser spots along a cutting line of the substrate;
• and
• a controller system configured to selectively activate or deactivate each laser such that operation of one laser is independent from another laser;
• wherein the output ends of the first, second and one or more additional optical fibers are movable relative to the substrate and are configured to image first, second and one or more additional laser beams onto the substrate simultaneously for cutting the substrate,
• wherein the apparatus is configured to switch off a laser spot of the horizontal array that extends beyond an edge of the substrate in use,
• wherein the first laser generates a laser beam of a different wavelength or at a different frequency from that generated by the second laser, and
• wherein the first laser is an infrared laser and the second laser is an ultraviolet laser.