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US 10,307,850 B2Granted
Solder removal from semiconductor devices
AssigneeMicron Technology, Inc.
InventorMark E. Tuttle
Life of this patent
Estimating the term…
Abstract
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Claims6
A solder removal apparatus, comprising:
- a plurality of solder-interfacing elongated solid pins extending from a body by a length, each of the plurality of solder-interfacing elongated solid pins having an outer surface of solder-wettable material configured to remove a corresponding one of a plurality of solder features from a semiconductor device, each of the plurality of solder features having a height and an amount of solder material, wherein the outer surface of at least one of the plurality of solder-interfacing elongated solid pins has an area sufficient to support the amount of solder material of the corresponding one of the plurality of solder features.
Dependencies are inferred from the claim text.