Cleaning device for cleaning electroplating substrate holder
AssigneeTaiwan Semiconducter Manufacturing Company Limited
InventorsYu-Young Wang, Chung-En Kao, Victor Y. Lu
Life of this patent
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Abstract
A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.
Claims11
A cleaning device for removing contamination on a substrate holder used with an electroplating cell, comprising:
- an arm;
- a cleaning agent supplier coupled to the arm and configured to supply a cleaning agent;
- a first nozzle coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination;
- and
- a receiver coupled to the arm, wherein:
- the receiver comprises a first sidewall and a second sidewall,
- the receiver is configured to receive the substrate holder between the first sidewall and the second sidewall such that the first sidewall and the second sidewall are on diametrically opposite sides of the substrate holder,
- the receiver is configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder, and
- the first nozzle is on the first sidewall.
Dependencies are inferred from the claim text.