Structure comprising a 2-dimensional material
AssigneeInternational Business Machines Corporation
InventorPio Peter Niraj Nirmalraj
Life of this patent
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Abstract
A method is provided for fabricating a structure including a two-dimensional material. The method includes a step of providing an electrically-conducting substrate and a step of forming a solid organic spacer layer on the electrically-conducting substrate. The method further includes depositing the two-dimensional material on the spacer layer. A structure formed according to the method includes an electrically-conducting substrate and a layer of a two-dimensional material. A solid organic spacer layer is arranged between the electrically-conducting substrate and the layer of the two-dimensional material.
Claims10
A method for fabricating a structure comprising a two-dimensional material, the method comprising the steps of:
- providing an electrically-conducting substrate;
- forming a solid organic spacer layer on the conducting substrate;
- and
- depositing the two-dimensional material on the spacer layer, the depositing performed at a gas pressure of approximately 2 mbar and utilizing a spray gun having a nozzle diameter of approximately 0.1 mm.
Dependencies are inferred from the claim text.