Wafer processing systems including multi-position batch load lock apparatus with temperature control capability

A wafer processing system, comprising:

• a transfer chamber;
• one or more processing chambers coupled to the transfer chamber, the one or more processing chambers included in one or more carousels;
• a factory interface;
• a first batch load lock apparatus coupled between the factory interface and the transfer chamber, the first batch load lock apparatus including multiple wafer stations;
• a second batch load lock apparatus coupled between the factory interface and the transfer chamber, the second batch load lock apparatus including multiple wafer stations;
• a support stack including a plurality of vertically oriented support members configured to support wafers and a temperature stack including a plurality of temperature control platforms in at least one of the first batch load lock apparatus and the second batch load lock apparatus, the support stack vertically moveable relative to the temperature stack wherein each of the multiple wafer station is comprised of a support member and a corresponding temperature control platform and one or more temperature control platforms includes fluid passages therein;
• a temperature sub-unit configured to heat and cool fluid, the fluid routed through the one or more fluid passages;
• and
• a robot within the transfer chamber and configured to transfer wafers between the one or more processing chambers and the first batch load lock apparatus and the second batch load lock apparatus;
• and wherein the plurality of vertically oriented support members are configured to move as a group.

A wafer processing system, comprising:

• a transfer chamber;
• one or more processing chambers coupled to the transfer chamber;
• two or more batch load lock apparatus coupled to the transfer chamber, the two or more batch load lock apparatus including multiple wafer stations;
• a support stack including a plurality of vertically oriented support members configured to support wafers;
• a temperature stack including a plurality of temperature control platforms, the support stack vertically moveable relative to the temperature stack;
• and
• each of the plurality of wafer stations formed from a combination of a support member and a corresponding temperature control platform;
• a robot within the transfer chamber and configured to transfer wafers between the one or more processing chambers and the two or more batch load lock apparatus;
• and
• a mainframe body including a first wall having a first opening, a second wall having a second opening, a third wall having a third opening, and a fourth wall having a fourth opening and a fifth opening, a first processing chamber of the one or more processing chambers having an opening coupled to the first opening, a second processing chamber of the one or more processing chambers having an opening coupled to the second opening, a third processing chamber of the one or more processing chambers having an opening coupled to the third opening, and the two or more batch load lock apparatus having openings coupled to the fourth opening and the fifth opening;
• and wherein the plurality of vertically oriented support members are configured to move as a group.