Film forming apparatus, method of forming film, and storage medium

A method of forming a thin film on a substrate in a processing container under a vacuum atmosphere by alternately supplying a first gas and a second gas, which are process gases, a predetermined number of times onto the substrate, the method comprising:

• forming, in the processing container, n first processing regions (n being an integer of 2 or more) spaced from each other along the circumferential direction of the processing container and n second processing regions along the circumferential direction with an isolation part interposed between the n first processing regions and the n second processing regions;
• installing 2n×m (m being an integer of 1 or more) mounting parts which are disposed to be revolved along a circumferential direction and are used to mount substrates, respectively;
• and
• repeating a cycle a predetermined number of time, the cycle including:
• (1) mounting the substrates on the mounting parts;
• (2) supplying a first gas and a second gas, which are process gases, into the n first processing regions and the n second processing regions, respectively, in a state where a revolution of the mounting parts is stopped so that the substrates are located in each of the n first processing regions and the n second processing regions;
• subsequently revolving the mounting parts to locate the substrates, which were located in each of the n first processing regions and the n second processing regions, in adjacent processing regions;
• and
• thereafter supplying the first gas and the second gas into the n first processing regions and the n second processing regions, respectively, in a state where the revolution of the mounting parts is stopped.