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US 10,246,588 B1Granted
Solvent-free resin composition and uses of the same
AssigneeTaiwan Union Technology Corporation
InventorsShur-Fen Liu, Chin-Hsien Hung
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Abstract
A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification.
Claims20
A solvent-free resin composition, comprising:
- (A) a benzoxazine resin of formula (I),
- (B) an epoxy resin with an alicyclic skeleton;
- (C) an epoxy resin hardener;
- (D) a benzoxazine resin hardener;
- and
- (E) a modified filler,
- wherein in formula (I),
- A is a C24-C48 divalent hydrocarbon group with one or more aliphatic side chains;
- B is a covalent bond,
- or a C1-C13 divalent hydrocarbon group;
- R is H or a C1-C15 alkyl;
- and
- n is an integer of 0 to 100.
10 more elements
Dependencies are inferred from the claim text.