Fast cure epoxy resins and prepregs obtained therefrom
AssigneeHexcel Holding GmbH
InventorBernhard Neumayer
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Abstract
This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.
Claims7
A composition comprising a semisolid epoxy resin containing a curative dispersed therein, said curative having a particle size such that at least 90% of the particles have a size below 25 μm at ambient temperature of 21° C., as determined in accordance with ASTM D1214, wherein the composition further comprises a diluent;
- said diluent comprising a particulate filler selected from micro balloons, glass, carbon, metal and/or combinations of the aforesaid fillers;
- and wherein, said composition further comprises a fibrous material, comprising a fleece.
Dependencies are inferred from the claim text.