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US 10,246,511 B2Granted
Fusion polypeptide capable of binding simultaneously to VEGF-C and VEGF-D
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang Hoon Lee, Hyung-Chan Kim, Sang Yeul Han, Seok Kyun Kim, Kyung Eun Kim
Life of this patent
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Abstract
A fusion polypeptide capable of binding simultaneously to angiopoietin 2, VEGF-C and VEGF-D; or capable of binding simultaneously to VEGF-C and VEGF-D, and methods for the preparation and use thereof.
Claims5
A fusion polypeptide capable of binding simultaneously to VEGF-C and VEGF-D, comprising a VEGFR2 extracellular domain, a VEGFR3 extracellular domain, and the Fc region of an immunoglobulin, wherein the VEGFR2 extracellular domain comprises Ig-like domain 2, and the VEGFR3 extracellular domain comprises Ig-like domain 2.
Dependencies are inferred from the claim text.