MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device

A MEMS device comprising:

• a substrate having a resin portion that protrudes from one surface thereof and is made of a resin and a first wiring that covers at least a portion of a surface of the resin portion,
• wherein the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and
• wherein a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction,
• wherein the resin portion includes a first portion and a second portion that is adjacent to the first portion along the second direction and of which a height from the one surface is lower than that of the first portion,
• wherein the first wiring is provided at a position overlapping the first portion,
• wherein a width of the first portion is equal to or larger than the width of the first wiring covering the first portion in the second direction,
• wherein a second wiring is between the first portion and the first wiring,
• wherein a width of the second wiring is equal or larger than the width of the first wiring covering the first portion in the second direction, and
• wherein the width of the second wiring is larger than the width of the first portion in the second direction.