Packages and methods of packaging sensors

A method of assembling a sensor in a sensor package comprising:

• aligning a first side of a ring to a base using a first mechanical mating interface in the shape of an arc on the ring and a second mechanical mating interface in the shape of an arc on the base, wherein the base has a sensor coupled to the base;
• aligning an electronics package with a second side opposite the first side of the ring where the ring has a ledge recessed down from the second side designed to receive the electronics package;
• filling via holes in the ring with a conductive material to form a plurality of vias such that a first electrical connection location on the base is electrically connected to a second electrical connection location on the electronics package, wherein each via of the plurality of vias terminates in a via termination point on the ledge and wherein each via termination point is surrounded by a recessed pocket;
• partially filling either the first or second mechanical mating interface with an adhesive;
• coupling the ring between the base and the electronics package;
• and
• curing the adhesive such that the base and ring are affixed.