Liquid ejecting head and method of manufacturing liquid ejecting head

A method of manufacturing a liquid ejecting head that has a wiring substrate having a first surface that is connected to a driver-element-forming substrate in which rows and a plurality of driver elements are provided, a part of the plurality of driver elements being included in the rows, and a second surface that is on the opposite side to the first surface and that is provided with a driver IC that outputs signals that drive the driver elements in the rows, a wire in the second surface that supplies electrical power to the driver elements and a through wire that extends between the first surface and the second surface, the method comprising:

• processing the wiring substrate so as to form a recessed portion that is recessed in the second surface of the wiring substrate in a thickness direction thereof and a through hole that penetrates through the wiring substrate, the wiring substrate being a board made of a silicon single crystal substrate, and
• forming the wire by filling a conductive material into the recessed portion and the through wire by filling the conductive material into the through hole.