Liquid discharge head, liquid discharge device, and method for manufacturing liquid discharge head

A method for manufacturing a liquid discharge head that includes a liquid discharge substrate configured to discharge liquid, the liquid discharge substrate including:

• a surface on which at least one pad is disposed close to a first edge;
• a first side surface that is adjacent to the surface with the first edge in between;
• at least one second side surface that is adjacent to the surface and the first side surface;
• and a back surface that is adjacent to the first side surface with a second edge in between opposing the first edge, a wiring substrate including at least one wiring, and a support substrate that is in contact with the second edge and includes a surface on which the back surface of the liquid discharge substrate is joined, the method comprising:
• joining the liquid discharge substrate and the support substrate to each other in such a manner that the second edge and at least one third edge intersect at an intersecting point and that the liquid discharge substrate has an end portion on a side of the at least one second side surface, protruding beyond an end portion of the surface of the support substrate, as viewed from the surface of the liquid discharge substrate, the at least one third edge forming the surface of the support substrate and being in contact with the back surface of the liquid discharge substrate;
• and
• applying a sealing agent to a space defined by the surface of the support substrate, the first side surface, and an electric connection portion in which the at least one pad and the at least one wiring are electrically connected to each other, the electric connection portion extending in a direction crossing the first edge as viewed from the surface of the liquid discharge substrate,
• wherein the sealing agent flows over a portion of the second edge toward the at least one second side surface from the space, to reach at least the intersecting point.

A method for manufacturing a liquid discharge head that includes a liquid discharge substrate configured to discharge liquid, the liquid discharge substrate including:

• a surface on which at least one pad is disposed close to a first edge;
• a first side surface that is adjacent to the surface with the first edge in between;
• at least one second side surface that is adjacent to the surface and the first side surface;
• and a back surface that is adjacent to the first side surface with a second edge in between opposing the first edge, a wiring substrate including at least one wiring, and a support substrate that is in contact with the second edge and includes a surface on which the back surface of the liquid discharge substrate is joined, the method comprising:
• joining the liquid discharge substrate and the support substrate to each other in such a manner that the second edge and at least one third edge intersect at an intersecting point and that the liquid discharge substrate has an end portion on a side of the at least one second side surface, protruding beyond an end portion of the surface of the support substrate, as viewed from the surface of the liquid discharge substrate, the at least one third edge forming the surface of the support substrate and being in contact with the back surface of the liquid discharge substrate;
• and
• applying a sealing agent to a space defined by the surface of the support substrate, the first side surface, and an electric connection portion in which the at least one pad and the at least one wiring are electrically connected to each other, the electric connection portion extending in a direction crossing the first edge as viewed from the surface of the liquid discharge substrate,
• wherein the sealing agent flows over a portion of the second edge toward the at least one second side surface from the space.