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US 10,245,668 B2Granted
Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
AssigneeKulicke and Soffa Industries, Inc.
InventorsDaniel P. Buergi, Thomas J. Colosimo, Jr., Edward T. Laurent, Michael P. Schmidt-Lange
Life of this patent
Estimating the term…
Abstract
A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.
Claims19
A bonding machine comprising:
- (a) a bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures;
- and
- (b) a fluxing system including (i) a flux holder defining a cavity for holding flux, and (ii) a fluid source for providing a cooling fluid to cool the flux holder, the cooling fluid being provided by the fluid source to a surface of the flux holder beneath the cavity,
- wherein, prior to bonding of the semiconductor element to the substrate, the bonding tool is configured to dip the conductive structures at least partially into the cavity such that the conductive structures contact the flux,
- the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.
2 more elements
A method of operating a fluxing system for a bonding machine, the method comprising the steps of:
- (a) providing a flux holder on the bonding machine defining a flux cavity, the flux cavity including flux;
- (b) providing a bond head assembly on the bonding machine, the bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures;
- (c) dipping the conductive structures at least partially into the cavity such that the conductive structures contact the flux prior to bonding the semiconductor element to the substrate;
- and
- (d) directing a cooling fluid from a fluid source to a surface of the flux holder beneath the cavity to cool the flux holder,
- the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.
3 more elements
Dependencies are inferred from the claim text.