Chip joining by induction heating
AssigneeGlobalfoundries Inc.
InventorsStephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
Life of this patent
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Abstract
Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.
Claims8
An apparatus for joining a chip with a substrate, the apparatus comprising:
- a pick-and-place machine including a pick-up head to for releasably holding the chip and a robotic arm for moving the pick-up head in a motion path;
- an induction heater including a plurality of coil turns located in the motion path directly over the substrate, the coil turns having an inner diameter defining an interior surface;
- and
- a power supply coupled with the induction heater, the power supply configured to supply electrical power with a time-varying alternating current to the coil turns of the induction heater for heating solder bumps on the chip by electromagnetic induction while the chip is releasably held by the pick-up head, wherein the pick-up head moves the chip axially through the interior surface of the coil turns and toward the substrate.
Dependencies are inferred from the claim text.