Cavity with silicon on insulator MEMS pressure sensing device with an extended shallow cross-shaped cavity
AssigneeContinental Automotive Systems, Inc.
InventorsJen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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AssigneeContinental Automotive Systems, Inc.
InventorsJen-Huang Albert Chiou, Shiuh-Hui Steven Chen
Estimating the term…
An improved microelectromechanical system (MEMS) pressure sensing device has an extended shallow polygon cavity on a top side of a silicon supporting substrate. A buried silicon dioxide layer is formed between the top side of the supporting substrate and a bottom side of a device layer. Piezoresistors and bond pads are formed and located on a top side of the device layer and produce measureable voltage changes responsive to a fluid pressure applied to the device layer. The purpose of the extend shallow polygon cavity is to improve the sensitivity or increase the span while keep a low pressure nonlinearity during shrinking the die size of the MEMS pressure sensing device die with corner metal bond pads having a keep-out distance to prevent a wire bonder from breaking the thin diaphragm.
A cavity silicon on insulator (CSOI) microelectromechanical system (MEMS) pressure sensing device comprising:
Dependencies are inferred from the claim text.