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US 10,209,297 B2Granted
Low cost apparatus for insitu testing of packaged integrated circuits during stressing
AssigneeTexas Instruments Incorporated
InventorsNing Tan, Jose Abdiel Rodriguez-Latorre
Life of this patent
Estimating the term…
Abstract
An apparatus with a burn-in board containing a microcontroller unit and a heater socket for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of multiple packaged integrated circuits while under stress.
Claims22
An apparatus comprising:
- a burn-in board;
- a microcontroller unit (MCU) mounted on the burn-in board;
- a heater socket defining an open top for receiving a packaged integrated circuit and the heater socket coupled with the MCU;
- and
- a heater in the heater socket with the heater positioned to contact a bottom portion of the packaged integrated circuit when the packaged integrated circuit is inserted into the heater socket and over the heater.
2 more elements
A method comprising:
- placing a packaged integrated circuit (IC) over and in contact with a heater mounted to a heater socket mounted on a burn-in board and coupled to a microcontroller unit (MCU) mounted on the burn-in board;
- receiving an actuation instruction by the MCU to actuate the packaged IC;
- receiving a stress instruction by the MCU for applying an accelerated stress to the plugged in packaged IC;
- applying the accelerated stress to the packaged IC based upon the received stress instruction;
- and
- collecting test data associated with the accelerated stress.
3 more elements
A method comprising:
- placing a first packaged integrated circuit (IC) over and in contact with a first heater mounted to a first heater socket mounted on a first burn-in board and coupled to a first microcontroller unit (MCU) mounted on the first burn-in board;
- placing a second packaged integrated circuit (IC) over and in contact with a second heater mounted to a second heater socket mounted on a second burn-in board and coupled to a second microcontroller unit (MCU) mounted on the second burn-in board;
- receiving a first actuation instruction by the first MCU to actuate the first packaged IC;
- receiving a second actuation instruction by the second MCU to actuate the second packaged IC;
- receiving a first stress instruction by the first MCU;
- receiving a second stress instruction by the second MCU;
- applying an first accelerated stress to the first packaged IC based upon the received first stress instruction;
- applying an second accelerated stress to the second packaged IC based upon the received second stress instruction;
- collecting first test data associated with the first accelerated stress;
- and
- collecting second test data associated with the second accelerated stress.
8 more elements
Dependencies are inferred from the claim text.