Support structure for electronics having fluid passageway for convective heat transfer

A method of manufacturing a support structure for a first electronic component and a second electronic component comprising:

• providing a chassis;
• providing a standoff, with a fluid passageway configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid;
• attaching the standoff to the chassis;
• supporting the first electronic component on the standoff separated at a distance from the chassis and such that the standoff is configured to receive heat generated by the electronic component;
• supporting a spacer on the standoff, the spacer including a plurality of projections that project outward and away from the standoff;
• and
• supporting the second electronic component on the spacer such that the second electronic component is spaced apart from the first electronic component.

A support structure for electronics comprising:

• a chassis that includes a base, at least one sidewall that is integrally attached to the base, and a top wall that is supported by the at least one sidewall, the top wall being spaced apart from the base, wherein the base, the at least one sidewall, and the top wall collectively define an interior of the chassis, wherein the at least one sidewall includes a sidewall fluid passageway, wherein the top wall includes a first aperture and a second aperture, and wherein the first aperture is in fluid communication with the sidewall fluid passageway;
• a standoff that is integrally attached to the base and that extends between the base and the top wall along an axis, wherein the standoff includes a standoff fluid passageway that is in fluid communication with the second aperture;
• a first printed circuit board (first PCB) that is supported by the standoff within the interior of the chassis, the standoff spacing the first PCB and the base of the chassis apart at a first distance;
• a spacer that is supported by the standoff, the spacer including a plurality of projections that project outward and away from the standoff;
• a second printed circuit board (second PCB) that is supported by the spacer apart at a second distance away from the first PCB;
• and
• a fan that is supported by the chassis outside the interior of the chassis, the fan configured to provide a first airflow through the first aperture and into the sidewall fluid passageway for convective heat transfer from the at least one sidewall to the first airflow, the fan configured to provide a second airflow through the second aperture and into the standoff fluid passageway for convective heat transfer from the standoff to the second airflow.