Imaging module

An imaging module comprising:

• a solid-state image sensing device comprising an imaging-device terminal;
• a connector having a first end face, a second end face located opposite to the first end face, and a side face orthogonal to the first end face, the connector comprising:
• a main body serving as an insulating member, an implanted conductor that is implanted in an inside of the main body, a first mounting terminal that is electrically connected to the imaging-device terminal and the implanted conductor and is provided on the first end face, a second mounting terminal that is provided on the side face and constitutes part of the implanted conductor, and a third mounting terminal that is provided on the second end face and constitutes part of the implanted conductor;
• a signal cable electrically connected to the second mounting terminal;
• and
• solder that electrically connects the third mounting terminal and the signal cable, wherein
• the third mounting terminal includes a terminal-front-end portion, and the terminal-front-end portion is located at a position apart from a connection surface between the second mounting terminal and the signal cable,
• the signal cable includes:
• a conductor, a coated portion, and a cable boundary portion located at a boundary between the conductor and the coated portion,
• the cable boundary portion is located outside the second end face,
• the solder coats the third mounting terminal and the conductor so as to form a curved surface that extends from the terminal-front-end portion to the cable boundary portion, and
• the connector, the signal cable, and the solder are positioned within a region surrounded by an external outline of the solid-state image sensing device as seen in the direction from the solid-state image sensing device to the second end face.