US 10,122,420 B2 · Wireless in-chip and chip to chip communication

Abstract

Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.

Claims19

Dependent claims

An apparatus to provide a simple and elegant wireless connection between integrated circuit dies, the apparatus comprising:

a first integrated circuit die including a plurality of integrated circuit devices and a first coil;
a second integrated circuit die including a second plurality of integrated circuit devices and a second coil;
and
a wire;
a third coil coupled directly to a first end of the wire;
a fourth coil coupled directly to a second end of the wire;
and
wherein the wire, the third coil, and the fourth coil are configured to wirelessly receive a signal from the first coil at the third coil, to conduct the signal from the first end of the wire to the second end of the wire, and to wirelessly transmit the signal from the fourth coil to the second coil.

5 more elements

Dependencies are inferred from the claim text.

Wireless in-chip and chip to chip communication

Life of this patent

Wireless in-chip and chip to chip communication

Life of this patent

Abstract

Claims19