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US 10,122,366 B2Granted
Crystal oscillation device
AssigneeMurata Manufacturing Co., Ltd.
InventorsToru Morita, Toshiyuki Kakuya, Kenji Takayama
Life of this patent
Estimating the term…
Abstract
A crystal oscillation device in which crystal unit is mounted on a package board as a package material and the package board is joined to a mounting board by conductive joining materials. Moreover, a gap is provided between the package board and the mounting board other than portions joined by the conductive joining material and the conductive joining material.
Claims18
A crystal oscillation device comprising:
- a first package material having opposing upper and lower surfaces;
- a crystal unit coupled to the upper surface of the first package material;
- a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board;
- and
- a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board,
- wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and
- wherein the mounting board includes first and second mounting board members spaced apart from each other to define the cavity, such that the temperature-sensitive element is disposed between the first and second mounting board members.
4 more elements
A crystal oscillation device comprising:
- a first package material having opposing upper and lower surfaces;
- a crystal unit coupled to the upper surface of the first package material;
- a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board;
- and
- a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board,
- wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and
- wherein the mounting board comprises a shape of a frame body with a cutout portion in a plan view, such that an outer side portion and an inner side portion surrounded by the frame body communicate with each other.
4 more elements
A crystal oscillation device comprising:
- a package material having opposing upper and lower surfaces;
- a crystal unit coupled to the upper surface of the package material;
- a temperature-sensitive element coupled to the lower surface of the package material;
- and
- a mounting board coupled to the lower surface of the package material by a plurality of conductive joining materials, such that the mounting board at least partially surrounds the temperature-sensitive element,
- wherein a gap is provided between the lower surface of the package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the package material, and
- wherein the mounting board includes first and second mounting board members spaced apart from each other, such that the temperature-sensitive element is disposed between the first and second mounting board members.
4 more elements
Dependencies are inferred from the claim text.