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US 10,122,358 B1Granted
Packaged semiconductor device
AssigneeMitsubishi Electric Corporation
InventorTakuya Shiraishi
Life of this patent
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Abstract
A semiconductor device includes: a transistor including a main terminal and a sense terminal; a main output electrode connected to the main terminal via a first wire; a sense output electrode connected to the sense terminal via a second wire; and a package sealing the transistor, the first and second wires, part of the main output electrode and part of the sense output electrode, wherein a wiring inductance from the main terminal to the main output electrode is larger than a wiring inductance from the sense terminal to the sense output electrode.
Claims8
A semiconductor device comprising:
- a transistor including a main terminal and a sense terminal;
- a main output electrode connected to the main terminal via a first wire;
- a sense output electrode connected to the sense terminal via a second wire;
- and
- a package sealing the transistor, the first and second wires, part of the main output electrode and part of the sense output electrode,
- wherein a wiring inductance from the main terminal to the main output electrode is larger than a wiring inductance from the sense terminal to the sense output electrode.
3 more elements
Dependencies are inferred from the claim text.