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US 10,122,139 B1Granted
Adapter apparatus with conductive elements mounted using laminate layer and methods regarding same
AssigneeIronwood Electronics, Inc.
InventorsDavid Allen Struyk, Kenneth Irving Krawza, Ilavarasan M. Palaniappa, Sultan Mahmood Faiz
Life of this patent
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Abstract
An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a flowable and curable laminate material.
Claims22
An adapter apparatus comprising:
- a substrate having a surface;
- a laminate material applied to the surface of the substrate;
- a plurality of openings defined through the substrate and the laminate material applied thereto;
- and
- a plurality of conductive elements, wherein each conductive element is mounted within a corresponding opening of the plurality of openings using the laminate material, wherein each conductive element comprise an end configured to receive solder material thereon, wherein the laminate material is flowed and cured to form a fillet seal of laminate material about a perimeter of the end of each conductive element bridging a gap between the conductive element and one or more surfaces defining the opening through the substrate in which the conductive element is mounted.
2 more elements
A method for use in forming an adapter apparatus, wherein the method comprises:
- providing a substrate and a sheet of laminate material applied on a surface of the substrate;
- defining a plurality of openings through the substrate and the sheet of laminate material applied thereto, wherein each of the plurality of the openings is configured to receive one of a plurality of conductive elements, wherein each of the plurality of conductive elements comprises an end configured to receive solder material thereon;
- inserting each of the plurality of conductive elements into a corresponding opening of the plurality of the openings;
- and
- flowing and curing the sheet of laminate material to form a seal of laminate material about a perimeter of the end of each conductive element bridging a gap between the conductive element and one or more surfaces defining the opening through the substrate in which the conductive element is inserted.
2 more elements
A method for use in forming an adapter apparatus, wherein the method comprises:
- providing a substrate;
- providing a dry flowable sheet of laminate material;
- affixing the sheet of laminate material to a surface of the substrate resulting in an exposed surface of the sheet of laminate material;
- defining a plurality of openings through the substrate and the sheet of laminate material affixed thereto, wherein each of the plurality of the openings is configured to receive one of a plurality of conductive elements;
- inserting each of the plurality of conductive elements into a corresponding opening of the plurality of the openings such that a portion of the conductive element and an end surface terminating the end of the conductive element is outside of the corresponding opening beyond the exposed surface of the sheet of laminate material;
- and
- flowing and curing the dry flowable sheet of laminate material to form a meniscus about the perimeter of each conductive element and between an end surface terminating an end of each conductive element and laminate material continuously affixed to the surface of the substrate between the conductive elements as laminate material wicks up the portion of the conductive element outside of the corresponding opening beyond the exposed surface of the sheet of laminate material.
4 more elements
Dependencies are inferred from the claim text.