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US 10,122,091 B2Granted
Microstrip patch antenna in cavity-backed structure including via-hole
AssigneesSamsung Electronics Co., Ltd., Korea Electronics Technology Institute
InventorsJae Sup Lee, Ho Jun Lee, Se Hwan Choi
Life of this patent
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Abstract
A microstrip patch antenna includes a via-hole pad including via-holes, a patch disposed on the via-hole pad, a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad, and a shorting via-hole disposed at a side of the patch, and configured to connect the patch and a ground unit.
Claims9
A microstrip patch antenna comprising:
- a via-hole pad comprising a metal pattern defined at an outer boundary of the via-hole pad;
- a patch disposed on the via-hole pad;
- and
- a ground unit disposed below the via-hole pad at a first height from the patch, a substrate having a second height disposed between the patch and the ground unit,
- wherein the first height is less than the second height,
- wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
- wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
- wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.
5 more elements
A microstrip patch antenna comprising:
- a via-hole pad corresponding to a cavity-backed structure, the via-hole pad comprising a metal pattern defined in an outer boundary of the via-hole pad;
- a patch disposed on the via-hole pad;
- a shorting via-hole configured to connect the patch and a ground unit;
- a feeding via-hole configured to feed a feed unit to the patch, the feeding via-hole disposed at a side of the patch and penetrating through the patch and the via-hole pad to the feed unit,
- wherein the ground unit is disposed at a first height from the patch, a substrate having a thickness defining a second height is disposed between the patch and the ground unit, and the first height is less than the second height,
- wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
- wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
- wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.
5 more elements
A microstrip patch antenna, comprising:
- a first layer comprising a patch;
- a second layer comprising a via-hole pad and a metal pattern disposed at an outer boundary of the via-hole pad;
- a third layer comprising a feed line and a ground unit, wherein the first layer, the second layer and the third layer are on different planes;
- a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad;
- and
- a shorting via-hole disposed at a side of the patch, and configured to connect the patch and the ground unit,
- wherein the second layer is disposed between the first layer and the third layer, and the feed line extends from a boundary of the microstrip patch antenna to connect with the patch,
- wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
- wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
- wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.
7 more elements
Dependencies are inferred from the claim text.