Wireless IC device, molded resin article, and method for manufacturing coil antenna

A molded resin article in which a wireless IC device is embedded, wherein

• the wireless IC device includes:
• a coil antenna;
• an RFIC element connected to the coil antenna;
• a printed wiring board including a first principal surface and a second principal surface;
• and
• a resin member adjacent to the first principal surface of the printed wiring board;
• wherein
• the coil antenna includes:
• a first conductor pattern provided on the printed wiring board;
• a first metal post that includes a first end and a second end and extends in a normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the first metal post being embedded in the resin member;
• a second metal post that includes a first end and a second end and extends in the normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the second metal post being embedded in the resin member;
• and
• a second conductor pattern provided on the resin member and including a first end connected to the second end of the first metal post and a second end connected to the second end of the second metal post;
• wherein
• the coil antenna has a winding axis that extends in a direction along the first principal surface of the printed wiring board;
• and
• the RFIC element is adjacent to the first principal surface of the printed wiring board, disposed between the first metal post and the second metal post, and embedded in the resin member.