Semiconductor light emitting device

A semiconductor light emitting device, comprising:

• a package body having a cavity surrounded by a side wall having a first reflective surface, the first reflective surface being inclined, the package body having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity;
• a semiconductor light emitting element mounted on the bottom surface of the cavity, and having a first electrode and a second electrode connected to the first wiring electrode and the second wiring electrode, respectively;
• a reflective resin portion in the cavity to surround the semiconductor light emitting element, having a curved upper surface providing a second reflective surface connected to the first reflective surface, and filling a space between the semiconductor light emitting element and the bottom surface of the cavity;
• and
• a wavelength conversion resin layer on the semiconductor light emitting element,
• wherein the semiconductor light emitting element further includes:
• an LED chip having a first surface with a first electrode and a second electrode disposed thereon, the first surface facing the bottom surface of the cavity, a second surface opposing the first surface, and lateral surfaces between the first surface and the second surface;
• a wavelength conversion film disposed on the second surface of the LED chip, and below the wavelength conversion resin layer;
• and
• a light-transmitting bonding layer disposed between the second surface of the LED chip and the wavelength conversion film to bond the LED chip to the wavelength conversion film, extending to the lateral surfaces of the LED chip, and having a surface inclined toward the bottom surface,
• wherein the wavelength conversion resin layer includes a first wavelength conversion material, and the wavelength conversion film includes a second wavelength conversion material.

A semiconductor light emitting device, comprising:

• a package body having a cavity surrounded by a side wall, and having a first wiring electrode and a second wiring electrode on a bottom surface of the cavity;
• an LED chip having a first surface with a first electrode and a second electrode disposed thereon, a second surface opposing the first surface, and lateral surfaces between the first surface and the second surface, the LED chip being mounted in the cavity such that the first surface faces the bottom surface;
• conductive bumps connecting the first electrode and the second electrode to the first wiring electrode and the second wiring electrode, respectively;
• a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material;
• a light-transmitting bonding layer between the second surface of the LED chip and the wavelength conversion film to bond the LED chip to the wavelength conversion film, and including a light-transmitting bonding material, the light-transmitting bonding material including a second wavelength conversion material;
• and
• a reflective resin portion in the cavity to surround the LED chip, and filling a space between the first surface of the LED chip and the bottom surface of the cavity.