Method for manufacturing semiconductor light emitting device package
AssigneeSamsung Electronics Co., Ltd.
InventorJong Sup Song
Life of this patent
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Abstract
There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.
Claims20
A method of manufacturing a semiconductor light emitting device package, the method comprising:
- disposing a plurality of light emitting structures, each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a support substrate;
- shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures;
- sintering the mixture to form a wavelength conversion part after the shaping the mixture containing the wavelength conversion material and the glass composition on the plurality of light emitting structures;
- removing the support substrate;
- and
- cutting the plurality of light emitting structures into individual device units.
A method of manufacturing a semiconductor light emitting device package, the method comprising:
- disposing a plurality of light emitting structures, each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a support substrate;
- shaping a mixture containing a wavelength conversion material and a glass composition while the mixture is on one surface of each light emitting structure of the plurality of light emitting structures;
- removing the support substrate from the plurality of light emitting structures after the shaping the mixture containing the wavelength conversion material and the glass composition on the one surface of each light emitting structure;
- and
- removing at least portions of the light emitting structures to separate the light emitting structures.
A method for manufacturing a semiconductor light emitting device package, the method comprising:
- forming a plurality of light emitting structures, each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a semiconductor substrate;
- disposing a support substrate on a first surface of the plurality of light emitting structures;
- removing the semiconductor substrate to expose a second surface of the plurality of light emitting structures;
- forming a pattern on the second surface of the plurality of light emitting structures to provide a patterned second surface of the plurality of light emitting structures;
- depositing a mixture containing a wavelength conversion material and a glass composition on at least a portion of the patterned second surface of the plurality of light emitting structures so that a bottom surface of the mixture facing the patterned second surface has a shape that conforms to a shape of the patterned second surface;
- after depositing the mixture, sintering the mixture while the mixture is on the plurality of light emitting structures to form a wavelength conversion part;
- removing the support substrate;
- and
- cutting the plurality of light emitting structures into individual device units.
Dependencies are inferred from the claim text.