Semiconductor device and method manufacturing the same
AssigneesHyundai Motor Company, Kia Motors Corporation
InventorsNackYong Joo, Youngkyun Jung, Junghee Park, JongSeok Lee, Dae Hwan Chun
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AssigneesHyundai Motor Company, Kia Motors Corporation
InventorsNackYong Joo, Youngkyun Jung, Junghee Park, JongSeok Lee, Dae Hwan Chun
Estimating the term…
A semiconductor device may include an n− type layer sequentially disposed at a first surface of an n+ type silicon carbide substrate; a p type region disposed in the n− type layer; an auxiliary n+ type region disposed on the p type region or in the p type region; an n+ type region disposed in the p type region; an auxiliary electrode disposed on the auxiliary n+ type region and the p type region; a gate electrode separated from the auxiliary electrode and disposed on the n− type layer; a source electrode separated from the auxiliary electrode and the gate electrode; and a drain electrode disposed at a second surface of the n+ type silicon carbide substrate, wherein the auxiliary n+ type region and the n+ type region are separated from each other, and the source electrode is in contact with the n+ type region.
A semiconductor device comprising:
A method for manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.