Semiconductor structure and method for manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Chyi Liu, Yu-Hsing Chang, Yung-Chang Chang, Shih-Chang Liu
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Chyi Liu, Yu-Hsing Chang, Yung-Chang Chang, Shih-Chang Liu
Estimating the term…
A semiconductor structure is disclosed. The semiconductor substrate includes: a front surface and a back surface; and a heterogeneous radiation-sensing region in the semiconductor substrate, the heterogeneous radiation-sensing region including a top surface, a bottom surface and sidewalls, the top surface being adjacent to the front surface of the semiconductor substrate, the sidewalls being perpendicular to the front surface of the semiconductor substrate, and the bottom surface being parallel to the front surface of the semiconductor substrate. An associated manufacturing method is also disclosed.
A semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.