Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTakeshi Sonehara, Masaru Kito
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AssigneeToshiba Memory Corporation
InventorsTakeshi Sonehara, Masaru Kito
Estimating the term…
According to embodiments, a semiconductor memory device includes a plurality of control gate electrodes laminated on a substrate. A first semiconductor layer has one end connected to the substrate, has a longitudinal direction in a direction intersecting with the substrate, and is opposed to the plurality of control gate electrodes. An electric charge accumulating layer is positioned between this control gate electrode and the first semiconductor layer. A first contact has one end connected to the substrate and another end connected to a source line. A second contact has one end connected to the substrate and another end connected to a wiring other than the source line. The first contact includes a first silicide layer arranged on the substrate. The second contact includes a second silicide layer arranged on the substrate. The first silicide layer has a higher temperature resistance than the second silicide layer.
A semiconductor memory device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.