Semiconductor integrated circuit and semiconductor module

A semiconductor module, comprising:

• a semiconductor integrated circuit including:
• a semiconductor substrate of a first conductivity type;
• a first well region of a second conductivity type formed in an upper portion of the semiconductor substrate;
• a second well region of the first conductivity type formed in an upper portion of the first well region;
• an insulating layer formed separated from the first well region on a bottom portion of the semiconductor substrate directly beneath the first well region;
• and
• a rear surface electrode layer formed below the insulating layer;
• an insulated circuit board having formed on a surface thereof a conductive layer on which to mount the semiconductor integrated circuit;
• a bonding layer that is interposed between the conductive layer and the rear surface electrode layer and bonds together the rear surface electrode layer and the conductive layer;
• a first active element including a first main electrode region and a second main electrode region both of the first conductivity type and formed in an upper portion of the first well region;
• a second active element including a third main electrode region and a fourth main electrode region both of the second conductivity type and formed in an upper portion of the second well region;
• and
• a switching element that is mounted on the insulated circuit board and controlled by the first active element and the second active element.