Method of manufacturing a semiconductor package

A method of manufacturing a semiconductor package, the method comprising:

• mounting a plurality of semiconductor chips on a top surface of a substrate;
• applying a non-conductive paste on the substrate and the semiconductor chips;
• forming a supporting layer between the substrate and each of the semiconductor chips;
• providing an interposer having a connecting member protruding toward the substrate onto the substrate;
• thermally pressing the interposer and the substrate to form a non-conductive layer between the substrate and the interposer,
• wherein forming the non-conductive layer comprises applying heat while pressing the interposer and the substrate against each other;
• bonding an external terminal to a bottom surface of the substrate;
• and
• cutting the substrate, the non-conductive layer, and the interposer between the semiconductor chips into unit packages separated from each other, wherein each unit package includes at least one of the semiconductor chips, and
• wherein the connecting member comprises:
• a pillar in contact with the interposer;
• and
• solder disposed on a bottom surface of the pillar.

A method of manufacturing a semiconductor package, the method comprising:

• providing a substrate having a plurality of connecting pads;
• mounting a plurality of semiconductor chips onto a surface of the substrate having the plurality of connecting pads such that the semiconductor chips are spaced apart from the surface of the substrate and such that the semiconductor chips are electrically connected to the plurality of connecting pads;
• providing a non-conductive material on the surface of the substrate wherein a portion of the non-conductive material partially fills a space between the semiconductor chips;
• providing an interposer over the substrate having the non-conductive material provided thereon, wherein one of the interposer or the substrate includes a connecting member protruding from a surface thereof, wherein the connecting member includes a pillar and solder disposed on the pillar;
• and
• in a thermal pressing process, applying heat to form a non-conductive layer between the substrate and the interposer while pressing the interposer and the substrate against the connecting member, wherein the non-conductive material and the connecting member are arranged such that the connecting member is pressed into the non-conductive material during the thermal pressing process.