US 10,121,759 B2 · On-bonder automatic overhang die optimization tool for wire bonding and related methods

Abstract

A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.

Claims11

Dependent claims

A method of a determining a maximum bond force to be applied to a bonding location during formation of a wire bond, the method comprising the steps of:

(a) providing a maximum z-axis deflection value for a semiconductor device;
(b) measuring z-axis deflection values at a plurality of bonding locations on at least one reference semiconductor device at a plurality of bond force values;
and
(c) determining the maximum bond force for each of the bonding locations.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/234,563Filed 11 Aug 2016 · us provisional application

Priority

4 Nov 2015

Published

US 2017/0125311 A14 May 2017

Granted

6 Nov 2018

Term ends

Not estimatedThe source records don’t support an estimate.

Classification23 codes

B23K 20/005
Wire welding: capillary welding
H10W 90/00
Package configurations
H10W 72/07113
Apparatus therefor: means for calibration
H10W 72/07141
Apparatus therefor: means for applying energy, e.g. ovens or lasers

On-bonder automatic overhang die optimization tool for wire bonding and related methods

Life of this patent

On-bonder automatic overhang die optimization tool for wire bonding and related methods

Life of this patent

Abstract

Claims11