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US 10,121,753 B2Granted
Enhanced solder pad
AssigneeInfineon Technologies AG
InventorsJens Oetjen, Stefan Macheiner
Life of this patent
Estimating the term…
Abstract
A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged on the tin layer.
Claims20
A solder pad, comprising:
- a surface;
- a tin layer arranged on the surface;
- and
- three layers:
- a bismuth layer and an antimony layer and a nickel layer, which are arranged on the tin layer, wherein a first of the three layers is arranged on the tin layer, a second of the three layers is arranged on the first layer and the third of the three layers is arranged on the second layer, wherein each layer covers essentially the entire respective underlying layer.
2 more elements
A solder pad, comprising:
- a surface;
- a tin layer arranged on the surface;
- and
- three layers:
- a bismuth layer and an antimony layer and a nickel layer, which are arranged on the tin layer, wherein the tin layer, the bismuth layer, the antimony layer and the nickel layer form a layer stack, and wherein a plurality of such layer stacks are formed on each other on the solder pad surface.
2 more elements
Dependencies are inferred from the claim text.