Sensor chip package assembly and electronic device having sensor chip package assembly

An electronic device, comprising a sensor chip package assembly, wherein the sensor chip package assembly comprises:

• a metal substrate having a bonding pad region and a placement region, wherein the bonding pad region having a plurality of metal bonding pads;
• a sensor chip being located on an upper surface of the metal substrate, wherein the sensor chip having a plurality of sensor chip bonding pads;
• an electrical connection assembly electrically connecting a metal bonding pad and a sensor chip bonding pad;
• a packaging material cover covering the metal substrate, the sensor chip and the electrical connection assembly, wherein a lower surface of the metal substrate is not covered by the packaging material cover, and any two adjacent metal bonding pads are spaced in an insulated manner by the packaging material cover;
• and
• an insulated cover on the packaging material cover, wherein the insulated cover comprises a metal particle, wherein a volume proportion of the metal particle in the insulated cover is less than 8%.

A method for producing a sensor chip package, comprising:

• coating an adhesive in a placement region of a metal substrate to form an adhesive layer in the placement region of the metal substrate;
• placing a sensor chip on the adhesive layer to make the sensor chip fixed on an upper surface of the placement region of the metal substrate;
• electrically connecting a sensor chip bonding pad with a metal bonding pad;
• placing an obtained assembly in a mold, an upper portion of the mold being higher than an upper surface of the sensor chip, and filling a liquid packaging material into the mold;
• solidifying an obtained chip assembly filled with the packaging material;
• etching the metal substrate along an edge of a bonding pad region to make the bonding pad region disconnected from the placement region;
• and
• covering an insulated cover on the packaging material, wherein the insulated cover comprises a metal particle, wherein a volume proportion of the metal particle in the insulated cover is less than 8%.