Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure

A method of making packaged electronic devices comprising:

• providing a first conductive frame structure comprising:
• a first sub-structure having a first conductive component;
• a second sub-structure having a second conductive component, wherein the first conductive component is adjoined to the second conductive component to provide a joined conductive structure connecting the first sub-structure to the second sub-structure;
• a first electronic die coupled to the first sub-structure;
• and
• a second electronic die coupled to the second sub-structure;
• providing a second conductive frame structure comprising:
• a first conductive connective structure;
• and
• a second conductive connective structure, wherein the first conductive connective structure is physically interconnected to the second conductive connective structure;
• attaching the first conductive connective structure to the first electronic die and the first conductive component and attaching the second conductive connective structure to at least the second electronic die to form a first sub-assembly;
• encapsulating portions of the first sub-assembly with an encapsulating layer to form an encapsulated sub-assembly, wherein at least portions of the first conductive frame structure are exposed to the outside of the encapsulated sub-assembly;
• removing all of the joined conductive structure to form a first conductive component exposed side surface and a second conductive component exposed side surface;
• forming a conductive layer on the exposed surfaces of the first conductive frame structure, on the first conductive component exposed side surface, and on the second conductive component exposed side surface;
• and
• separating the encapsulated sub-assembly to provide a first packaged electronic device having the first conductive component exposed side surface covered by the conductive layer and a second packaged electronic device having the second conductive component exposed side surface covered by the conductive layer.

A method of forming packaged semiconductor devices, comprising:

• providing a first conductive frame structure having die pads and joined conductive portions, wherein the joined conductive portions comprise one or more of joined leads or leads joined to the die pads;
• attaching semiconductor devices to the die pads;
• providing a second conductive frame structure comprising a plurality of interconnected conductive connective structures;
• attaching the plurality of interconnected conductive connective structures to the joined conductive portions and the semiconductor devices to provide a first sub-assembly;
• encapsulating the first sub-assembly with an encapsulating layer to provide an encapsulated sub-assembly;
• removing the joined conductive portions of the first conductive frame structure to form a plurality of conductive flank surfaces disposed on side surfaces of the encapsulated sub-assembly;
• after the step of removing the joined conductive portions, using the plurality of interconnected conductive connective structures as a conductive source to form a conductive layer on the conductive flank surfaces;
• and
• separating the encapsulated sub-assembly to provide the packaged semiconductor devices each having portions of the conductive flank surfaces covered by the conductive layer, wherein the separating includes separating the plurality of interconnected conductive connective structures.