Semiconductor device

A semiconductor device comprising:

• a substrate;
• and
• interposer layers sequentially stacked on the substrate, wherein the interposer layers form an active region and an open region, the interposer layers comprising:
• a device layout pattern formed within the active region of the interposer layers;
• and
• a stress release structure formed within the open region of the interposer layers and comprising groups of multiple openings, each group of openings comprising multiple openings oriented in a column relative to one another and sharing a longitudinal axis,
• wherein each opening of a respective group of openings extends through a single interposer layer of the interposer layers, and
• wherein material of at least one interposer layer of the interposer layers is disposed between adjacent openings within a respective group of openings;
• and
• stiffener films, each stiffener film of the stiffener films being disposed on a respective interposer layer of the interposer layers and on a surface of the respective interposer layer opposite the substrate.

A semiconductor device comprising:

• a substrate;
• and
• interposer layers sequentially stacked on the substrate, wherein the interposer layers form an active region and an open region, wherein the active region comprises a six-sided shape having five interior right angles and defining a cutout corner, and wherein the open region comprises a square shape and is disposed within the cutout corner of the active region, the plurality of interposer layers comprising:
• a device layout pattern formed within the active region of the interposer layers;
• and
• a stress release structure formed within the open region of the interposer layers and comprising multiple groups of openings, each group of openings comprising multiple openings oriented in a column relative to one another and sharing a longitudinal axis,
• wherein each opening of a respective group of openings extends through a single interposer layer of the interposer layers, and
• wherein material of at least one interposer layer of the interposer layers is disposed between adjacent openings within a respective group of openings.