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US 10,121,732 B2Granted
Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate
AssigneeMitsubishi Electric Corporation
InventorsYoshitaka Kimura, Yoshitaka Otsubo
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Abstract
A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.
Claims6
A semiconductor device comprising:
- a base plate including a metallic base plate and an insulating film provided on the metallic base plate;
- a semiconductor chip provided on the base plate;
- a control board disposed above the semiconductor chip;
- and
- a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board,
- wherein the relay terminal is directly fixed to the insulating film of the base plate.
3 more elements
Dependencies are inferred from the claim text.