Systems for thermal management and methods for the use thereof

A heat-dispersing assembly comprising:

• 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
• a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
• 25 μm to 150 μm of a porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
• 25 μm to 50 μm thickness of a thermal conductive/protective layer, and
• 5 μm to 10 μm thickness of an electrical insulation layer.

A heat-dispersing assembly comprising:

• 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
• a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
• 25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
• 25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 25 μm to 50 μm thickness of a thermal conductive/protective layer, and
• 5 μm to 10 μm thickness of an electrical insulation layer.

A heat-dispersing assembly comprising:

• 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
• a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
• 25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
• 25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 5 μm to 10 μm thickness of a third pressure sensitive adhesive layer,
• 25 μm to 150 μm of a third porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
• 25 μm to 50 μm thickness of a thermal conductive/protective layer, and
• 5 μm to 10 μm thickness of an electrical insulation layer.